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MSE 565

MSE 565 -

Spring 2021

Documents

Official Description

Thin solid films bonded to relatively thick substrates such as microelectronic devices, thermal barrier coatings in gas turbine engines, mems devices, flexible electronics, and biomedical instruments. Quantitative understanding of the consequences of mechanical stress in film-substrate structures, arising from fabrication methods or service conditions: substrate curvature, film delamination, film fracture, dislocation formation, plastic flow and stress-driven evolution of surface morphology.