MSE 565

MSE 565 - Thin Film Materials

Fall 2015

Thin Film MaterialsMSE565A63624LCD30930 - 1050 T R  305 Materials Science & Eng Bld Lambert Ben Freund


Official Description

Thin solid films bonded to relatively thick substrates such as microelectronic devices, thermal barrier coatings in gas turbine engines, mems devices, flexible electronics, and biomedical instruments. Quantitative understanding of the consequences of mechanical stress in film-substrate structures, arising from fabrication methods or service conditions: substrate curvature, film delamination, film fracture, dislocation formation, plastic flow and stress-driven evolution of surface morphology.